Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5635220 | Molding die for sealing semiconductor device with reduced resin burrs | Takehito Inaba, Kousuke Azuma | 1997-06-03 |
| 5623163 | Leadframe for semiconductor devices | — | 1997-04-22 |