Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5691567 | Structure for attaching a lead frame to a heat spreader/heat slug structure | Boonmi Mekdhanasarn, Daniel P. Tracy | 1997-11-25 |
| 5617297 | Encapsulation filler technology for molding active electronics components such as IC cards or PCMCIA cards | Hem Takiar | 1997-04-01 |