Issued Patents 1997
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5629563 | Component stacking in multi-chip semiconductor packages | Uli H. Hegel, Peter Howard Spalding, James L. Crozier, Michelle M. Hou-Chang, Martin A. Delateur | 1997-05-13 |
| 5625235 | Multichip integrated circuit module with crossed bonding wires | — | 1997-04-29 |
| 5621635 | Integrated circuit packaged power supply | — | 1997-04-15 |
| 5617297 | Encapsulation filler technology for molding active electronics components such as IC cards or PCMCIA cards | Randy Lo | 1997-04-01 |
| 5596225 | Leadframe for an integrated circuit package which electrically interconnects multiple integrated circuit die | Ranjan J. Mathew | 1997-01-21 |