Issued Patents 1997
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5702957 | Method of making buried metallization structure | — | 1997-12-30 |
| 5691218 | Method of fabricating a programmable polysilicon gate array base cell structure | Michael J. Colwell, Teh-Kuin Lee, Jane C.T. Chiu, Abraham Yee, Stanley Yeh | 1997-11-25 |
| 5621616 | High density CMOS integrated circuit with heat transfer structure for improved cooling | Alexander H. Owens | 1997-04-15 |
| 5600182 | Barrier metal technology for tungsten plug interconnection | Richard Schinella, Joseph M. Zelayeta | 1997-02-04 |