PL

Pei-Ing Lee

IBM: 2 patents #396 of 3,557Top 15%
SC Siemens Components: 1 patents #2 of 6Top 35%
📍 Hsinchu, VT: #1 of 1 inventorsTop 100%
Overall (1997): #27,636 of 185,788Top 15%
2
Patents 1997

Issued Patents 1997

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
5641992 Metal interconnect structure for an integrated circuit with improved electromigration reliability Bernd Vollmer, Darryl D. Restaino, Bill Klaasen 1997-06-24
5608257 Fuse element for effective laser blow in an integrated circuit device Frank Prein 1997-03-04