Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5697148 | Flip underfill injection technique | Robert Kenneth Doot, Karl M. Wahlfrid | 1997-12-16 |
| 5647123 | Method for improving distribution of underfill between a flip chip die and a circuit board | Jonathon G. Greenwood, Robert Kenneth Doot | 1997-07-15 |