Issued Patents 1997
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5679498 | Method for producing high density multi-layer integrated circuit carriers | Douglas W. Hendricks, Frank J. Juskey | 1997-10-21 |
| 5647123 | Method for improving distribution of underfill between a flip chip die and a circuit board | James George Lance, Jr., Robert Kenneth Doot | 1997-07-15 |
| 5625224 | Method and apparatus for an integrated circuit chip carrier having improved mounting pad density | Reed A. George | 1997-04-29 |
| 5598967 | Method and structure for attaching a circuit module to a circuit board | Douglas W. Hendricks, Frank J. Juskey | 1997-02-04 |