Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5691568 | Wire bondable package design with maxium electrical performance and minimum number of layers | Sanjay Dandia | 1997-11-25 |
| 5672911 | Apparatus to decouple core circuits power supply from input-output circuits power supply in a semiconductor device package | Sadanand R. Patil, Prabhansu Chakrabarti | 1997-09-30 |