Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5691568 | Wire bondable package design with maxium electrical performance and minimum number of layers | Tai-Yu Chou | 1997-11-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5691568 | Wire bondable package design with maxium electrical performance and minimum number of layers | Tai-Yu Chou | 1997-11-25 |