Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5681777 | Process for manufacturing a multi-layer tab tape semiconductor device | Brian Lynch | 1997-10-28 |
| 5638596 | Method of employing multi-layer tab tape in semiconductor device assembly by selecting, breaking, downwardly bending and bonding tab tape trace free ends to a ground or power plane | — | 1997-06-17 |
| 5639385 | Method of fabricating a wafer probe card for testing an integrated circuit die | — | 1997-06-17 |