Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5698465 | Process for manufacturing an interconnect bump for flip-chip integrated circuit including integral standoff and hourglass shaped solder coating | Patrick E. O'Brien | 1997-12-16 |
| 5681777 | Process for manufacturing a multi-layer tab tape semiconductor device | John McCormick | 1997-10-28 |