Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5648686 | Connecting electrode portion in semiconductor device | Naohiko Hirano, Kazuhide Doi, Takashi Okada, Yoichi Hiruta | 1997-07-15 |
| 5629566 | Flip-chip semiconductor devices having two encapsulants | Kazuhide Doi, Takashi Okada, Naohiko Hirano, Yoichi Hiruta | 1997-05-13 |