Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5648686 | Connecting electrode portion in semiconductor device | Naohiko Hirano, Masayuki Miura, Takashi Okada, Yoichi Hiruta | 1997-07-15 |
| 5645123 | Semiconductor device having temperature regulation means formed in circuit board | Naohiko Hirano | 1997-07-08 |
| 5629566 | Flip-chip semiconductor devices having two encapsulants | Masayuki Miura, Takashi Okada, Naohiko Hirano, Yoichi Hiruta | 1997-05-13 |