Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5631499 | Semiconductor device comprising fine bump electrode having small side etch portion and stable characteristics | Eiichi Hosomi, Chiaki Takubo, Hiroshi Tazawa, Takashi Arai, Koji Shibasaki | 1997-05-20 |