Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5631499 | Semiconductor device comprising fine bump electrode having small side etch portion and stable characteristics | Eiichi Hosomi, Hiroshi Tazawa, Ryouichi Miyamoto, Takashi Arai, Koji Shibasaki | 1997-05-20 |
| 5615822 | Method and apparatus for controlling bonding load of fine lead electrode | Hiroshi Tazawa, Eiichi Hosomi, Koji Shibasaki | 1997-04-01 |