Issued Patents 1997
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5677246 | Method of manufacturing semiconductor devices | Hideaki Maeta, Katsuhiko Oyama, Yumiko Ohshima, Takahito Nakazawa | 1997-10-14 |
| 5677575 | Semiconductor package having semiconductor chip mounted on board in face-down relation | Hideaki Maeta | 1997-10-14 |
| 5628111 | Methods of fabricating of semiconductor package and mounting of semiconductor device | Hideo Aoki | 1997-05-13 |
| 5612532 | Thin IC card and method for producing the same | — | 1997-03-18 |
| 5599389 | Compound semiconductor and method of manufacturing the same | — | 1997-02-04 |