Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5677246 | Method of manufacturing semiconductor devices | Katsuhiko Oyama, Hiroshi Iwasaki, Yumiko Ohshima, Takahito Nakazawa | 1997-10-14 |
| 5677575 | Semiconductor package having semiconductor chip mounted on board in face-down relation | Hiroshi Iwasaki | 1997-10-14 |