Issued Patents 1997
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5702984 | Integrated mulitchip memory module, structure and fabrication | Claude L. Bertin, Erik L. Hedberg, Howard L. Kalter, Gordon A. Kelley, Jr. | 1997-12-30 |
| 5691248 | Methods for precise definition of integrated circuit chip edges | John Cronin, Howard L. Kalter, Patricia E. Marmillion, Anthony M. Palagonia, Bernadette Ann Pierson +1 more | 1997-11-25 |
| 5686843 | Methods and apparatus for burn-in stressing and simultaneous testing of semiconductor device chips in a multichip module | Kenneth E. Beilstein, Jr., Claude L. Bertin, Dennis Charles Dubois, Gordon A. Kelley, Jr., Christopher P. Miller +4 more | 1997-11-11 |
| 5670428 | Semiconductor chip kerf clear method and resultant semiconductor chip and electronic module formed from the same | Kenneth E. Beilstein, Jr., Claude L. Bertin, Timothy H. Daubenspeck | 1997-09-23 |
| 5648684 | Endcap chip with conductive, monolithic L-connect for multichip stack | Claude L. Bertin, Howard L. Kalter | 1997-07-15 |
| 5644162 | Semiconductor chip having chip metal layer and transfer metal layer composed of same metal, and corresponding electronic module | Kenneth E. Beilstein, Jr., Claude L. Bertin, Timothy H. Daubenspeck | 1997-07-01 |
| 5614277 | Monolithic electronic modules--fabrication and structures | Kenneth E. Beilstein, Jr., Claude L. Bertin | 1997-03-25 |
| 5596226 | Semiconductor chip having a chip metal layer and a transfer metal and corresponding electronic module | Kenneth E. Beilstein, Jr., Claude L. Bertin, Timothy H. Daubenspeck | 1997-01-21 |