Issued Patents 1997
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5659203 | Reworkable polymer chip encapsulant | Anson J. Call, Stephen L. Buchwalter, Stanley J. Jasne, Frank L. Pompeo, Paul A. Zucco +1 more | 1997-08-19 |
| 5623394 | Apparatus for cooling of chips using a plurality of customized thermally conductive materials | Raed A. Sherif, Mark G. Courtney, David L. Edwards, Albert Joseph Fahey, Gregory S. Hopper +2 more | 1997-04-22 |
| 5604978 | Method for cooling of chips using a plurality of materials | Raed A. Sherif, Mark G. Courtney, David L. Edwards, Albert Joseph Fahey, Gregory S. Hopper +2 more | 1997-02-25 |
| 5591789 | Polyester dispersants for high thermal conductivity paste | Keith Olsen, Krishna G. Sachdev | 1997-01-07 |