Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5700581 | Solvent-free epoxy based adhesives for semiconductor chip attachment and process | Michael Berger, Mark S. Chace | 1997-12-23 |
| 5643818 | Removal of residues from metallic insert used in manufacture of multi-layer ceramic substrate with cavity for microelectronic chip | Thomas E. Lombardi, Vincent P. Peterson | 1997-07-01 |
| 5591789 | Polyester dispersants for high thermal conductivity paste | Sushumna Iruvanti, Keith Olsen | 1997-01-07 |