Issued Patents 1997
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5687078 | Fine pitch bonding | Chandrasekhar Narayan, Michael J. Palmer | 1997-11-11 |
| 5675884 | Apparatus for multilayer conductor chip packaging | Alphonso P. Lanzetta, Ismail C. Noyan, Michael J. Palmer | 1997-10-14 |
| 5676301 | Castellated nozzle and method of use thereof | Bernie Hernandez, Michael J. Palmer, Frederick G. Weindelmayer | 1997-10-14 |
| 5669437 | High efficiency thermal interposer | Bernardo Hernandez, Ismail C. Noyan, Michael J. Palmer | 1997-09-23 |
| 5641114 | Controlled temperature bonding | Chandrasekhar Narayan, Michael J. Palmer | 1997-06-24 |
| 5593083 | Castellated nozzle and method of use therof | Bernie Hernandez, Michael J. Palmer, Frederick G. Weindelmayer | 1997-01-14 |