Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5675884 | Apparatus for multilayer conductor chip packaging | Raymond R. Horton, Alphonso P. Lanzetta, Michael J. Palmer | 1997-10-14 |
| 5669437 | High efficiency thermal interposer | Bernardo Hernandez, Raymond R. Horton, Michael J. Palmer | 1997-09-23 |