Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5702532 | MOCVD reactor system for indium antimonide epitaxial material | Randy K. Rolph, Timothy T. Zielinski | 1997-12-30 |
| 5616517 | Flip chip high power monolithic integrated circuit thermal bumps and fabrication method | Wah S. Wong, William D. Gray | 1997-04-01 |