Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5616517 | Flip chip high power monolithic integrated circuit thermal bumps and fabrication method | Cheng P. Wen, William D. Gray | 1997-04-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5616517 | Flip chip high power monolithic integrated circuit thermal bumps and fabrication method | Cheng P. Wen, William D. Gray | 1997-04-01 |