Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5614761 | Electronic circuit package including plural semiconductor chips formed on a wiring substrate | Nobuyasu Kanekawa, Hirokazu Ihara, Kiyoshi Kawabata, Hisayoshi Yamanaka, Tetsuya Okishima | 1997-03-25 |