Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE35663 | Method and apparatus for transportation of materials | Kinji Mori, Yasuo Suzuki, Masayuki Orimo, Shoji Miyamoto | 1997-11-18 |
| 5614761 | Electronic circuit package including plural semiconductor chips formed on a wiring substrate | Nobuyasu Kanekawa, Masatsugu Akiyama, Kiyoshi Kawabata, Hisayoshi Yamanaka, Tetsuya Okishima | 1997-03-25 |