Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5661061 | Process for fabricating a semiconductor integrated circuit device having the multi-layered fin structure | Hirohisa Usuami, Masayuki Kojima, Kazuo Nojiri, Keiji Okamoto | 1997-08-26 |