Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5699234 | Stacking of three dimensional high density interconnect modules with metal edge contacts | Richard Joseph Saia, Bernard Gorowitz | 1997-12-16 |
| 5657537 | Method for fabricating a stack of two dimensional circuit modules | Richard Joseph Saia, Bernard Gorowitz | 1997-08-19 |
| 5652559 | Method of micromachining electromagnetically actuated current switches with polyimide reinforcement seals, and switches produced thereby | Richard Joseph Saia, Mario Ghezzo, Bharat S. Bagepalli | 1997-07-29 |