Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5699234 | Stacking of three dimensional high density interconnect modules with metal edge contacts | Richard Joseph Saia, Kevin Matthew Durocher | 1997-12-16 |
| 5657537 | Method for fabricating a stack of two dimensional circuit modules | Richard Joseph Saia, Kevin Matthew Durocher | 1997-08-19 |