Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5679268 | Thin multi-layer circuit board and process for fabricating the same | Yasuhito Takahashi, Kenji Iida, Masaru Sumi, Yuichiro Ohta, Toshiro Katsube +3 more | 1997-10-21 |
YK
Yasunaga Kurokawa
Overall (1997): #57,593 of 185,788Top 35%
1
Patents 1997