Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5679268 | Thin multi-layer circuit board and process for fabricating the same | Yasuhito Takahashi, Yasunaga Kurokawa, Kenji Iida, Masaru Sumi, Yuichiro Ohta +3 more | 1997-10-21 |