Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5666270 | Bump electrode, semiconductor integrated circuit device using the same, multi-chip module having the semiconductor integrated circuit devices and method for producing semicondutcor device having the bump electrode | Masaharu Minamizawa | 1997-09-09 |
| 5637535 | Semiconductor device with reliable electrodes of projecting shape and method of forming same | Masataka Mizukoshi, Masaharu Minamizawa, Toshiyuki Motooka | 1997-06-10 |
| 5607877 | Projection-electrode fabrication method | Masaharu Minamizawa | 1997-03-04 |