Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5643831 | Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device | Masayuki Ochiai, Hidefumi Ueda, Michio Sono, Ichiro Yamaguchi, Kazuhiko Mitobe +6 more | 1997-07-01 |
| 5637535 | Semiconductor device with reliable electrodes of projecting shape and method of forming same | Tatsuharu Matsuda, Masaharu Minamizawa, Toshiyuki Motooka | 1997-06-10 |