Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5679978 | Semiconductor device having resin gate hole through substrate for resin encapsulation | Toshimi Kawahara, Mitsunada Osawa, Shinichirou Taniguchi, Mayumi Osumi, Hiroyuki Ishiguro +2 more | 1997-10-21 |