Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5679978 | Semiconductor device having resin gate hole through substrate for resin encapsulation | Toshimi Kawahara, Shinya Nakaseko, Mitsunada Osawa, Shinichirou Taniguchi, Hiroyuki Ishiguro +2 more | 1997-10-21 |
| 5616164 | Methods for making metal particle spherical and removing oxide film solder paste and soldering method | Masayuki Ochiai, Kaoru Hashimoto, Toshimi Kawahara | 1997-04-01 |