Issued Patents 1997
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5683529 | Process of producing aluminum nitride multiple-layer circuit board | Hiroshi Makihara, Koji Omote, Mineharu Tsukada | 1997-11-04 |
| 5659004 | Epoxy resin composition | Yukio Takigawa, Yoshihiro Nakata, Shigeaki Yagi, Norio Sawatari | 1997-08-19 |
| 5643831 | Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device | Masayuki Ochiai, Hidefumi Ueda, Michio Sono, Ichiro Yamaguchi, Kazuhiko Mitobe +6 more | 1997-07-01 |
| 5629269 | Process for forming oxide superconducting films with a plurality of metal buffer layers | Kazunori Yamanaka, Takuya Uzumaki, Koichi Niwa | 1997-05-13 |
| 5593526 | Process for preparing a multi-layer wiring board | Kishio Yokouchi, Hiroshi Kamezaki, Masato Wakamura, Koichi Niwa | 1997-01-14 |