Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5593526 | Process for preparing a multi-layer wiring board | Hiroshi Kamezaki, Masato Wakamura, Nobuo Kamehara, Koichi Niwa | 1997-01-14 |
KY
Kishio Yokouchi
Overall (1997): #117,671 of 185,788Top 65%
1
Patents 1997