SY

Shing Yeh

DE Delco Electronics: 1 patents #27 of 166Top 20%
📍 Buffalo Grove, IL: #17 of 61 inventorsTop 30%
🗺 Illinois: #1,118 of 4,656 inventorsTop 25%
Overall (1997): #77,043 of 185,788Top 45%
1
Patents 1997

Issued Patents 1997

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
5607099 Solder bump transfer device for flip chip integrated circuit devices William D. Higdon, Ralph Edward Cornell 1997-03-04