William D. Higdon

DE Delco Electronics: 1 patents #27 of 166Top 20%

📍 Greentown, IN: #1 of 7 inventorsTop 15%

🗺 Indiana: #496 of 1,942 inventorsTop 30%

Overall (1997): #60,003 of 185,788Top 35%

Patents 1997

Issued Patents 1997

Showing 1–1 of 1 patents

Patent #	Title	Co-Inventors	Date
5607099	Solder bump transfer device for flip chip integrated circuit devices	Shing Yeh, Ralph Edward Cornell	1997-03-04