Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5646828 | Thin packaging of multi-chip modules with enhanced thermal/power management | Yinon Degani, Byung Joon Han, Alan Michael Lyons | 1997-07-08 |
| 5608262 | Packaging multi-chip modules without wire-bond interconnection | Yinon Degani, Byung Joon Han, Alan Michael Lyons, King Lien Tai | 1997-03-04 |