Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5689878 | Method for protecting electronic circuit components | Donald W. Dahringer, Philip Hubbauer, William LAMBERT, Lloyd Shepherd, John D. Weld | 1997-11-25 |
| 5646828 | Thin packaging of multi-chip modules with enhanced thermal/power management | Yinon Degani, Thomas Dixon Dudderar, Byung Joon Han | 1997-07-08 |
| 5608262 | Packaging multi-chip modules without wire-bond interconnection | Yinon Degani, Thomas Dixon Dudderar, Byung Joon Han, King Lien Tai | 1997-03-04 |