Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5698160 | Lead-free alloys for use in solder bonding | Ho S. Chen, Sungho Jin | 1997-12-16 |
| 5618189 | Solder medium for circuit interconnection | Sungho Jin | 1997-04-08 |
| 5591037 | Method for interconnecting an electronic device using a removable solder carrying medium | Sungho Jin | 1997-01-07 |