Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5698160 | Lead-free alloys for use in solder bonding | Sungho Jin, Mark Thomas McCormack | 1997-12-16 |
| 5622305 | Bonding scheme using group VB metallic layer | Donald D. Bacon, Cheng-Hsuan Chen, Avishay Katz, King Lien Tai | 1997-04-22 |