Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5693561 | Method of integrated circuit fabrication including a step of depositing tungsten | Leonard J. Olmer, Ronald J. Schutz | 1997-12-02 |
| 5641994 | Multilayered A1-alloy structure for metal conductors | Cheryl Anne Bollinger, Edward Dein, Arun K. Nanda, Pradip K. Roy, Cletus W. Wilkins, Jr. | 1997-06-24 |
| 5599739 | Barrier layer treatments for tungsten plug | Arun K. Nanda, Pradip K. Roy | 1997-02-04 |