Issued Patents 1994
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5376756 | Wire support and guide | — | 1994-12-27 |
| 5369550 | Method and apparatus for cooling a molded-plastic integrated-circuit package | — | 1994-11-29 |
| 5365409 | Integrated circuit package design having an intermediate die-attach substrate bonded to a leadframe | Louis H. Liang | 1994-11-15 |
| 5332864 | Integrated circuit package having an interposer | Louis H. Liang, Sang S. Lee | 1994-07-26 |
| 5317106 | Coplanar corrector ring | — | 1994-05-31 |