Issued Patents 1994
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5365409 | Integrated circuit package design having an intermediate die-attach substrate bonded to a leadframe | Young I. Kwon | 1994-11-15 |
| 5359227 | Lead frame assembly and method for wiring same | Sang S. Lee | 1994-10-25 |
| 5350713 | Design and sealing method for semiconductor packages | — | 1994-09-27 |
| 5332864 | Integrated circuit package having an interposer | Sang S. Lee, Young I. Kwon | 1994-07-26 |
| 5296744 | Lead frame assembly and method for wiring same | Sang S. Lee | 1994-03-22 |