Issued Patents 1994
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5371321 | Package structure and method for reducing bond wire inductance | Ahmad Hamzehdoost | 1994-12-06 |
| 5371403 | High performance package using high dielectric constant materials for power/ground and low dielectric constant materials for signal lines | Elizabeth C. Galindo | 1994-12-06 |
| 5302022 | Technique for measuring thermal resistance of semiconductor packages and materials | Kenny Y. Ng | 1994-04-12 |