Issued Patents 1994
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5371321 | Package structure and method for reducing bond wire inductance | Chin-Ching Huang | 1994-12-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5371321 | Package structure and method for reducing bond wire inductance | Chin-Ching Huang | 1994-12-06 |