Issued Patents 1994
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5364903 | Molded products for molding compositions containing thermalsetting (meth)acrylate liquid resins | Yuji Takayama, Hirotaka Wada | 1994-11-15 |
IK
Iwao Komiya
Overall (1994): #121,931 of 165,921Top 75%
1
Patents 1994