Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5364903 | Molded products for molding compositions containing thermalsetting (meth)acrylate liquid resins | Hirotaka Wada, Iwao Komiya | 1994-11-15 |
| 5331041 | Polymerizable compositions and in-mold cured products using same | Hirokazu Matsueda, Masato Sugiura, Tatsuhiko Ozaki, Hirotaka Wada, Toshiharu Suzuki | 1994-07-19 |